Kód: 06506804
Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molde ... celý popis
Nákupom získate 550 bodov
Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Other technologies & applied sciences Applied optics
222.35 €
Osobný odber Bratislava a 2642 dalších
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