Kód: 06506804
Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molde ... celý popis
Angličtina
Nákupom získate 476 bodov
Anotácia knihy
Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Parametre knihy
Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Other technologies & applied sciences Applied optics
197.05 €
Angličtina
Osobný odber Bratislava a 12542 dalších
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