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Viac informácií o knihe Pick-up Process Analysis of a Die Bonder

• Parametre knihy
• Anotácia kniha
• Obľúbené z iného súdka

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Anotácia knihy

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Mechanical engineering & materials Mechanical engineering

• Celý názov: Pick-up Process Analysis of a Die Bonder
• Autor: Yeong-Jyh Lin, Sheng-Jye Hwang
• Jazyk: Angličtina
• Väzba: Brožovaná
• Počet strán: 136
• EAN: 9783639000344
• ISBN: 363900034X
• ID: 06810235
• Nakladateľ: VDM Verlag Dr. Mueller E.K.
• Hmotnosť: 191 g
• Rozmery: 229 × 152 × 7 mm
• Dátum vydania: 22. April 2008

Obľúbené z iného súdka

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