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Viac informácií o knihe Three-Dimensional Integration of Semiconductors

• Parametre knihy
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Nákupom získate 244 bodov

Anotácia knihy

This book starts with background concerning three-dimensional interconnects - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. Then it covers their numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others.§The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Three-Dimensional Integration of Semiconductors
• Podnázov: Processing, Materials, and Advanced Applications
• Autor: Kazuo Kondo, Morihiro Kada, Kenji Takahashi
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 408
• EAN: 9783319186740
• ISBN: 3319186744
• ID: 09266952
• Nakladateľ: Springer International Publishing AG
• Hmotnosť: 7627 g
• Rozmery: 235 × 155 × 245 mm
• Dátum vydania: 09. December 2015

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