Kód: 01651230
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of ... celý popis
473.01 €
Potrebujete viac kusov?Ak máte záujem o viac kusov, preverte, prosím, najprv dostupnosť titulu na našej zákazníckej podpore.
Nákupom získate 1179 bodov
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Mechanical engineering & materials Materials science
473.01 €
Osobný odber Bratislava a 2642 dalších
Copyright ©2008-24 najlacnejsie-knihy.sk Všetky práva vyhradenéSúkromieCookies
Nákupný košík ( prázdny )