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Viac informácií o knihe Wafer Bonding

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• Anotácia kniha
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Nákupom získate 870 bodov

Anotácia knihy

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Celý názov: Wafer Bonding
• Podnázov: Applications and Technology
• Autor: Marin Alexe, Ulrich Gösele
• Jazyk: Angličtina
• Väzba: Brožovaná
• Počet strán: 504
• EAN: 9783642059155
• ISBN: 3642059155
• ID: 01651230
• Nakladateľ: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
• Hmotnosť: 795 g
• Rozmery: 235 × 155 × 29 mm
• Dátum vydania: 01. July 2011

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