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Viac informácií o knihe Wafer Level 3-D ICs Process Technology

• Parametre knihy
• Anotácia kniha
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Anotácia knihy

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging.§This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Energy technology & engineering Electrical engineering

• Celý názov: Wafer Level 3-D ICs Process Technology
• Autor: Chuan Seng Tan, L. Rafael Reif, Ronald J. Gutmann
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 410
• EAN: 9780387765327
• ISBN: 0387765328
• ID: 01382901
• Nakladateľ: Springer-Verlag New York Inc.
• Hmotnosť: 656 g
• Rozmery: 241 × 166 × 23 mm
• Dátum vydania: 01. August 2008

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