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Viac informácií o knihe Chemical-Mechanical Planarization: Volume 867

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Anotácia knihy

Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Technology: general issues Engineering: general

• Celý názov: Chemical-Mechanical Planarization: Volume 867
• Podnázov: Integration, Technology and Reliability
• Autor: E. C. Johns, A. Kumar, J. a. Lee
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 302
• EAN: 9781558998209
• ISBN: 1558998209
• ID: 02060414
• Nakladateľ: Materials Research Society
• Dátum vydania: 19. July 2005

Obľúbené z iného súdka

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