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Viac informácií o knihe Electronic Packaging Materials Science X: Volume 515

• Parametre knihy
• Anotácia kniha
• Obľúbené z iného súdka

Nákupom získate 69 bodov

Anotácia knihy

Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Technology: general issues Technical design

• Celý názov: Electronic Packaging Materials Science X: Volume 515
• Autor: Daniel J. BeltonMichael GaynesElizabeth G. JacobsRaymond Pearson
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 262
• EAN: 9781558994218
• ISBN: 1558994211
• ID: 02060166
• Nakladateľ: Materials Research Society
• Hmotnosť: 614 g
• Rozmery: 234 × 157 × 23 mm
• Dátum vydania: 01. October 1998

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