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Viac informácií o knihe Fundamentals of Lead-Free Solder Interconnect Technology

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Anotácia knihy

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Fundamentals of Lead-Free Solder Interconnect Technology
• Podnázov: From Microstructures to Reliability
• Autor: Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
• Jazyk: Angličtina
• Väzba: Brožovaná
• Počet strán: 253
• EAN: 9781489978011
• ISBN: 1489978011
• ID: 15178309
• Nakladateľ: Springer-Verlag New York Inc.
• Hmotnosť: 559 g
• Rozmery: 235 × 155 × 10 mm
• Dátum vydania: 01. October 2016

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