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Viac informácií o knihe Through Silicon Vias

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Nákupom získate 674 bodov

Anotácia knihy

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Through Silicon Vias
• Autor: Brajesh Kumar Kaushik
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 216
• EAN: 9781498745529
• ISBN: 9781498745529
• ID: 10041079
• Nakladateľ: Taylor & Francis Inc
• Hmotnosť: 498 g
• Rozmery: 165 × 253 × 18 mm
• Dátum vydania: 26. August 2016

Obľúbené z iného súdka

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