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Viac informácií o knihe Advanced Metallization Conference 1999 (AMC 1999): Volume 15

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Anotácia knihy

The revolution in materials and processes for IC metallization presents exciting challenges for the future. This book, the 16th in a popular series from MRS, provides a forum within the IC metallization community, across industrial, academic and government institutions, for presentation and discussion of leading-edge research, development and technology. In particular, the volume focuses on Cu and low-k dielectrics spanning materials, properties, processing, integration and reliability. Two keynote addresses are featured - one on 'The MARCO/DARPA Interconnect Focus Cente' a cooperative research program involving several top universities in the U.S. whose mission it is to explore new interconnect strategies for the future, the other on 'Low-Cost and High-Performance DRAM Technology'. Additional topics include: integration of damascene architectures; copper-deposition processes and properties; barriers for copper; low-k dielectrics; aluminum, tungsten and DRAM metallization; silicides; CMP/cleaning/etching; process modeling and reliability.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Advanced Metallization Conference 1999 (AMC 1999): Volume 15
• Autor: M. E. GrossT. GessnerN. KobayashiY. Yasuda
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 763
• EAN: 9781558995390
• ISBN: 1558995390
• ID: 02060265
• Nakladateľ: Materials Research Society
• Hmotnosť: 1136 g
• Rozmery: 234 × 165 × 46 mm
• Dátum vydania: 01. January 2000

Obľúbené z iného súdka

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