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Viac informácií o knihe Fabrication, Packaging and Integration of MEMS and Related Microsystems

• Parametre knihy
• Anotácia kniha
• Obľúbené z iného súdka

Nákupom získate 496 bodov

Anotácia knihy

This is the first book dedicated to packaging and integration of MEMS and related Microsystems. While packaging was once considered secondary, it has now developed its own standards throughout the world. The book discusses the three key features for next generation application specific systems-on-a-chip (SOC): Mixed Signals, Mixed Environmental Domains, and Varying Scales of Devices and Packaging Components.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Fabrication, Packaging and Integration of MEMS and Related Microsystems
• Autor: Ajay P. Malshe
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 500
• EAN: 9780387728926
• ID: 01382611
• Nakladateľ: Springer, Berlin
• Rozmery: 235 × 155 mm
• Dátum vydania: 14. December 2011

Obľúbené z iného súdka

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