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Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.§To begin with, a thorough introductory section acquaints readers with the fundamentals of wafer bonding and the challenges facing this key technology. In the second part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The third and final part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Handbook of Wafer Bonding
• Autor: Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 425
• EAN: 9783527326464
• ISBN: 3527326464
• ID: 01550963
• Nakladateľ: Wiley-VCH Verlag GmbH
• Hmotnosť: 932 g
• Rozmery: 246 × 177 × 24 mm
• Dátum vydania: 11. January 2012

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