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Viac informácií o knihe Stress Induced Phenomena in Metallization

• Parametre knihy
• Anotácia kniha
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Anotácia knihy

Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.

Parametre knihy

• Celý názov: Stress Induced Phenomena in Metallization
• Podnázov: Sixth International Workshop on Stress Induced Phenomena in Metallization, Ithaca, New York, 25-27 July 2001
• Autor: Shefford P. Baker, Matti A. Korhonen, Eduard Arzt, Paul S. Ho
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 250
• EAN: 9780735400580
• ID: 01390770
• Nakladateľ: Springer, Berlin
• Hmotnosť: 590 g
• Rozmery: 235 × 155 mm
• Rok vydania: 2002

Obľúbené z iného súdka

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